Cite
HARVARD Citation
Zhang, L. et al. (2010). Approach on thermoelectricity reliability of board-level backplane based on the orthogonal experiment design. International journal of materials and structural integrity. pp. 170-185. [Online].
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Zhang, L. et al. (2010). Approach on thermoelectricity reliability of board-level backplane based on the orthogonal experiment design. International journal of materials and structural integrity. pp. 170-185. [Online].