Cite
APA Citation
Chu, K., Sohn, Y., & Moon, C. (2015). a comparative study of Cn/Sn/Cu and Ni/Sn/Ni solder joints for low temperature stable transient liquid phase bonding. Scripta materialia, 109, 113–117. http://access.bl.uk/ark:/81055/vdc_100073691201.0x000001