Cite
HARVARD Citation
Chu, K. et al. (2015). A comparative study of Cn/Sn/Cu and Ni/Sn/Ni solder joints for low temperature stable transient liquid phase bonding. Scripta materialia. pp. 113-117. [Online].
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Chu, K. et al. (2015). A comparative study of Cn/Sn/Cu and Ni/Sn/Ni solder joints for low temperature stable transient liquid phase bonding. Scripta materialia. pp. 113-117. [Online].