Effect of annealing on the microstructure and bonding interface properties of Ag–2Pd alloy wire. Issue 8 (July 2015)

• Record Type: Journal Article
• Authors: Tseng, Yi-Wei; Hung, Fei-Yi; Lui, Truan-Sheng; Chen, Mei-Yu; Hsueh, Hao-Wen
• Is Part Of: Microelectronics and reliability. Volume 55:Issue 8(2015)
• Page Start: 1256
• Page End: 1261
• Publication Date: 2015-07
• Subjects: Ag–Pd -- Wire bonding -- Mechanical properties -- Electrical test; Electronic apparatus and appliances -- Reliability -- Periodicals; Miniature electronic equipment -- Periodicals; Appareils électroniques -- Fiabilité -- Périodiques; Équipement électronique miniaturisé -- Périodiques; Electronic apparatus and appliances -- Reliability; Miniature electronic equipment; Periodicals; 621.3815
• DOI: 10.1016/j.microrel.2015.05.012
• Languages: English
• ISSNs: 0026-2714

Abstract

Highlights: The study developed an Ag–2Pd wire for high electrical conductivity and cost savings. Annealing at 275 °C is suitable for obtaining high-quality Ag–2Pd wire. The IMCs of the Ag–2Pd and Al system were mainly Ag3 (Pd)Al and Ag2 (Pd)Al. Annealing Ag–2Pd wire is a novel and efficient design. Abstract: This study investigated the mechanical and electrical properties of Ag–2Pd wire after thermal annealing. The thermal stability of the tested wire was examined by separately imposing static annealing at 275 °C, 325 °C and 375 °C in a vacuum environment. It was found that annealing the Ag–2Pd wire at 275 °C promoted the formation of a fully annealed structure with equiaxed grains. Annealing Ag–2Pd wire had a shorter heat affect zone (HAZ) length than those of conventional wire, and offered outstanding mechanical properties. A long-term electrical test found Ag3 (Pd)Al and Ag2 (Pd)Al compounds between the Ag–Pd ball and Al pad. These results confirmed the high-reliability properties of annealed Ag–2Pd wires for the wire bonding process.