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MLA Citation
Tengyun Liu et al.. “Fracture strength of silicon wafers sawn by fixed diamond wire saw.” Solar energy, vol. 157, 2017, pp. 427–433. http://access.bl.uk/ark:/81055/vdc_100053926980.0x00005b
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Tengyun Liu et al.. “Fracture strength of silicon wafers sawn by fixed diamond wire saw.” Solar energy, vol. 157, 2017, pp. 427–433. http://access.bl.uk/ark:/81055/vdc_100053926980.0x00005b