Transient surface modifications during singular heating events at diode laser facets. (29th March 2016)

• Record Type: Journal Article
• Authors: Hempel, Martin; Tomm, Jens W; Bachmann, Alexander; Lauer, Christian; Furitsch, Michael; Strauß, Uwe; Elsaesser, Thomas
• Is Part Of: Semiconductor science and technology. Volume 31:Number 5(2016:May)
• Publication Date: 2016-03-29
• Subjects: diode laser -- kinetics -- surface modification -- catastrophic optical damage; Semiconductors -- Periodicals; 621.38152
• DOI: 10.1088/0268-1242/31/5/055007
• Languages: English
• ISSNs: 0268-1242

Abstract

Abstract: Surface morphology changes and transient reflectance changes at diode laser facets are monitored during the catastrophic optical damage (COD) process in a single pulse operation. Time-resolved micro-reflectance spectroscopy with a streak-camera (time resolution ∼20 ns) allows us to observe the creation sequence of up to four distinct degradation seed points at a device facet within <300 ns. The shape of the COD seeds is created within <30–40 ns. Creation of non-planar facet areas by local melting represents the main mechanism behind the observed reflectivity changes. Subsequently the surface temperature decreases within the pulse which caused the COD.