Cite
HARVARD Citation
Oswald, S. et al. (2018). AES and XPS depth‐profiling of annealed AlN/Ti‐Al/AlN films for high‐temperature applications in SAW metallization. Surface and interface analysis. pp. 991-995. [Online].
This is an interim version of our Electronic Legal Deposit Catalogue-eJournals and eBooks while we continue to recover from a cyber-attack.
Oswald, S. et al. (2018). AES and XPS depth‐profiling of annealed AlN/Ti‐Al/AlN films for high‐temperature applications in SAW metallization. Surface and interface analysis. pp. 991-995. [Online].