Cite
HARVARD Citation
Ji, H. et al. (2016). Rapid formation of intermetallic joints through ultrasonic-assisted die bonding with Sn–0.7Cu solder for high temperature packaging application. Scripta materialia. pp. 19-23. [Online].
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Ji, H. et al. (2016). Rapid formation of intermetallic joints through ultrasonic-assisted die bonding with Sn–0.7Cu solder for high temperature packaging application. Scripta materialia. pp. 19-23. [Online].