Rapid formation of intermetallic joints through ultrasonic-assisted die bonding with Sn–0.7Cu solder for high temperature packaging application. (1st January 2016)

• Record Type: Journal Article
• Authors: Ji, Hongjun; Qiao, Yunfei; Li, Mingyu
• Is Part Of: Scripta materialia. Volume 110(2016)
• Page Start: 19
• Page End: 23
• Publication Date: 2016-01-01
• Subjects: Ultrasonic-assisted soldering -- Die bonding -- Microstructure -- Intermetallic joint -- Thermal conductivity; Materials -- Periodicals; Metallurgy -- Periodicals; Metalen; Legeringen; Materiaalkunde; Metals, metalworking and machinery industries; Metals; Electronic journals; 620.11
• DOI: 10.1016/j.scriptamat.2015.07.036
• Languages: English
• ISSNs: 1359-6462

Abstract

Graphical abstract: Abstract: Rapid formation of complete intermetallic-phases (IPs)-composed joints during die bonding for high temperature applications was achieved by pressureless and fluxless ultrasonic-assisted soldering in air within seconds. The joint consisted of sole (Cu, Ni)6 Sn5 plus a thin layer of Cu3 Sn possessed a rather low thermal resistance of 0.252 mm 2 K W −1 and a high shear strength of 69 MPa. This rapid formation of fully IPs-composed structures was probably accelerated by ultrasonic cavitation and streaming effects through supersaturation of copper in the melted solder. Compared with transient-liquid-phase soldering, this method dramatically reduces the processing time and there was no external force acted on the dies.