Cite
MLA Citation
Ming Xiao et al.. “Fabrication and characterization of Cu-Sn-Ni-Cu interconnection microstructure for electromigration studies in 3D integration.” Soldering & surface mount technology, vol. 28, no. 2, 2016, pp. 74–83. http://access.bl.uk/ark:/81055/vdc_100033241570.0x00005b