Cite
MLA Citation
Yan Wang et al.. “A facile process combined with inkjet printing, surface modification and electroless deposition to fabricate adhesion-enhanced copper patterns on flexible polymer substrates for functional flexible electronics.” Electrochimica acta, vol. 218, 2016, pp. 24–31. http://access.bl.uk/ark:/81055/vdc_100071265627.0x00005f