Cite
APA Citation
Liu, Y., Chen, Y., Gu, S., Kim, D., & Tu, K. (2016). fracture reliability concern of (Au, Ni)Sn4 phase in 3D integrated circuit microbumps using Ni/Au surface finishing. Scripta materialia, 119, 9–12. http://access.bl.uk/ark:/81055/vdc_100069038788.0x000048