Cite
HARVARD Citation
Liu, Y. et al. (2016). Fracture reliability concern of (Au, Ni)Sn4 phase in 3D integrated circuit microbumps using Ni/Au surface finishing. Scripta materialia. pp. 9-12. [Online].
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Liu, Y. et al. (2016). Fracture reliability concern of (Au, Ni)Sn4 phase in 3D integrated circuit microbumps using Ni/Au surface finishing. Scripta materialia. pp. 9-12. [Online].