A fusion prognostics-based qualification test methodology for microelectronic products. (August 2016)

• Record Type: Journal Article
• Authors: Pecht, Michael; Shibutani, Tadahiro; Kang, Myeongsu; Hodkiewicz, Melinda; Cripps, Edward
• Is Part Of: Microelectronics and reliability. Volume 63(2016)
• Page Start: 320
• Page End: 324
• Publication Date: 2016-08
• Subjects: Microelectronics -- Physics-of-failure -- Prognostics -- Qualification testing -- Reliability; Electronic apparatus and appliances -- Reliability -- Periodicals; Miniature electronic equipment -- Periodicals; Appareils électroniques -- Fiabilité -- Périodiques; Équipement électronique miniaturisé -- Périodiques; Electronic apparatus and appliances -- Reliability; Miniature electronic equipment; Periodicals; 621.3815
• DOI: 10.1016/j.microrel.2016.04.002
• Languages: English
• ISSNs: 0026-2714

Abstract

Abstract: The global market for microelectronic products is projected to reach US$2.4 trillion per year by 2020. This growth has led to intense competition between manufacturers to minimize the time-to-market for their products. Unfortunately, however, qualification testing, which is time-consuming and resource-intensive, is a major bottleneck for the quick release of microelectronic products to the market. Hence, for both researchers and engineers considering the time with reliability issues during qualification testing, this paper provides a review of conventional methodologies in qualification testing and presents a fusion prognostics-based qualification test methodology that combines the advantages of physics-of-failure and data-driven methods.