82‐2: Substrate‐Free Flexible Electronics Manufacturing by Weak Bonding Method. Issue 1 (30th May 2018)
- Record Type:
- Journal Article
- Title:
- 82‐2: Substrate‐Free Flexible Electronics Manufacturing by Weak Bonding Method. Issue 1 (30th May 2018)
- Main Title:
- 82‐2: Substrate‐Free Flexible Electronics Manufacturing by Weak Bonding Method
- Authors:
- Ke, Tsung-Ying
Lee, Chih-Tsung
Cheng, Kuei-Ning
Su, Wei-Jen
Kang, Ting
Wang, Wan-Tsang
Liu, Chun-Hsin
Lin, Yu-Hsin - Abstract:
- Abstract : By using weak bonding method, a flexible electronics either of organic or inorganic substrate formed on a rigid carrier glass can be directly separated from the carrier glass, with protection film‐assisted, by mechanical de‐bonding method. Without PI substrate, multi‐advantages are demonstrated for flexible OLED display production.
- Is Part Of:
- Digest of technical papers. Volume 49:Issue 1(2018)
- Journal:
- Digest of technical papers
- Issue:
- Volume 49:Issue 1(2018)
- Issue Display:
- Volume 49, Issue 1 (2018)
- Year:
- 2018
- Volume:
- 49
- Issue:
- 1
- Issue Sort Value:
- 2018-0049-0001-0000
- Page Start:
- 1106
- Page End:
- 1109
- Publication Date:
- 2018-05-30
- Subjects:
- Weak bonding -- Debonding layer (DBL) -- Mechanical debonding -- PI-free -- Stress
Information display systems -- Congresses
621.3815422 - Journal URLs:
- http://catalog.hathitrust.org/api/volumes/oclc/1799368.html ↗
http://onlinelibrary.wiley.com/journal/10.1002/(ISSN)2168-0159 ↗
http://ojps.aip.org/dbt/dbt.jsp?KEY=SIDSYM ↗
http://sid.aip.org/digest ↗
http://onlinelibrary.wiley.com/ ↗ - DOI:
- 10.1002/sdtp.12121 ↗
- Languages:
- English
- ISSNs:
- 0097-966X
- Deposit Type:
- Legaldeposit
- View Content:
- Available online (eLD content is only available in our Reading Rooms) ↗
- Physical Locations:
- British Library DSC - 8271.680000
British Library DSC - BLDSS-3PM
British Library STI - ELD Digital store - Ingest File:
- 7068.xml