82‐2: Substrate‐Free Flexible Electronics Manufacturing by Weak Bonding Method. Issue 1 (30th May 2018) - Ke, Tsung-Ying
Abstract : By using weak bonding method, a flexible electronics either of organic or inorganic substrate formed on a rigid carrier glass can be directly separated from the carrier glass, with protection film‐assisted, by mechanical de‐bonding method. Without PI substrate, multi‐advantages are demonstrated for flexible OLED display production.