A novel sandwich differential capacitive accelerometer with symmetrical double-sided serpentine beam-mass structure. (21st December 2015)

• Record Type: Journal Article
• Authors: Xiao, D B; Li, Q S; Hou, Z Q; Wang, X H; Chen, Z H; Xia, D W; Wu, X Z
• Is Part Of: Journal of micromechanics and microengineering. Volume 26:Number 2(2016:Feb.)
• Publication Date: 2015-12-21
• Subjects: accelerometer -- serpentine beam -- pre-buried mask -- sandwich -- silicon pillar structure; Microelectromechanical systems -- Periodicals; Micromechanics -- Periodicals; 621.38105
• DOI: 10.1088/0960-1317/26/2/025005
• Languages: English
• ISSNs: 0960-1317

Abstract

Abstract: This paper presents a novel differential capacitive silicon micro-accelerometer with symmetrical double-sided serpentine beam-mass sensing structure and glass–silicon–glass sandwich structure. The symmetrical double-sided serpentine beam-mass sensing structure is fabricated with a novel pre-buried mask fabrication technology, which is convenient for manufacturing multi-layer sensors. The glass–silicon–glass sandwich structure is realized by a double anodic bonding process. To solve the problem of the difficulty of leading out signals from the top and bottom layer simultaneously in the sandwich sensors, a silicon pillar structure is designed that is inherently simple and low-cost. The prototype is fabricated and tested. It has low noise performance (the peak to peak value is 40 μ g) and μ g-level Allan deviation of bias (2.2 μ g in 1 h), experimentally demonstrating the effectiveness of the design and the novel fabrication technology.