Cite
MLA Citation
L. Meinshausen et al.. “Electro- and thermomigration induced Cu3Sn and Cu6Sn5 formation in SnAg3.0Cu0.5 bumps.” Microelectronics and reliability, vol. 55, no. 1, 2015, pp. 192–200. http://access.bl.uk/ark:/81055/vdc_100057343680.0x000001