Cite
HARVARD Citation
Meinshausen, L. et al. (2015). Electro- and thermomigration induced Cu3Sn and Cu6Sn5 formation in SnAg3.0Cu0.5 bumps. Microelectronics and reliability. 55 (1), pp. 192-200. [Online].
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Meinshausen, L. et al. (2015). Electro- and thermomigration induced Cu3Sn and Cu6Sn5 formation in SnAg3.0Cu0.5 bumps. Microelectronics and reliability. 55 (1), pp. 192-200. [Online].