Thermal design and characterization of a modular integrated liquid cooled 1200 V-35 A SiC MOSFET bi-directional switch. (September 2017)

• Record Type: Journal Article
• Authors: Cova, P.; Aliyu, A.M.; Castellazzi, A.; Chiozzi, D.; Delmonte, N.; Lasserre, P.; Pignoloni, N.
• Is Part Of: Microelectronics and reliability. Volume 76/77(2017)
• Page Start: 277
• Page End: 281
• Publication Date: 2017-09
• Subjects: High power density -- Packaging -- System integration -- Thermal design -- Liquid cooling; Electronic apparatus and appliances -- Reliability -- Periodicals; Miniature electronic equipment -- Periodicals; Appareils électroniques -- Fiabilité -- Périodiques; Équipement électronique miniaturisé -- Périodiques; Electronic apparatus and appliances -- Reliability; Miniature electronic equipment; Periodicals; 621.3815
• DOI: 10.1016/j.microrel.2017.06.062
• Languages: English
• ISSNs: 0026-2714

Abstract

Abstract: The aim of this work is the thermal design of a modular direct liquid cooled package for 1200 V–35 A SiC power MOSFETs, in order to take full advantage of the high power density and high frequency performance of these devices, in the development of a modular integrated solution for power converters. An accurate electro-thermal fluid dynamic model is set up and validated by thermal characterization on a prototype; numerical models have been used to study the internal temperature distribution and to propose further optimization.