Qualification extension of automotive smart power and digital ICs to harsh aerospace mission profiles: Gaps and opportunities. (September 2017)

• Record Type: Journal Article
• Authors: Enrici Vaion, R.; Medda, M.; Mancaleoni, A.; Mura, G.; Pintus, A.; De Tomasi, M.
• Is Part Of: Microelectronics and reliability. Volume 76/77(2017)
• Page Start: 438
• Page End: 443
• Publication Date: 2017-09
• Subjects: Electronic apparatus and appliances -- Reliability -- Periodicals; Miniature electronic equipment -- Periodicals; Appareils électroniques -- Fiabilité -- Périodiques; Équipement électronique miniaturisé -- Périodiques; Electronic apparatus and appliances -- Reliability; Miniature electronic equipment; Periodicals; 621.3815
• DOI: 10.1016/j.microrel.2017.07.061
• Languages: English
• ISSNs: 0026-2714

Abstract

Abstract: Historically the aerospace market has always chosen high level reliability solutions through customized technologies and processes, in order to cope with the requirement driven by mission profiles and application environment severity. In parallel, Automotive market required more and more high reliability targets. As a consequence, the qualification activity has evolved, passing from a stress driven approach strictly based on AEC-Q100 standard to a failure mode driven approach oriented to satisfy the robustness criteria required by TIER1 and Car Makers. Starting from this scenario, new market opportunities for Automotive devices can be identified, since the most reliable of them are today eligible to be sold to aerospace manufacturers with important cost saving thanks to massive production volumes of consolidated technologies. A gap may still persist and has to be carefully explored. First of all, a study of the different application constraints has to be carried out and the potential failure modes activated by Aerospace cold unbalanced mission profile, atmospheric pressure and radiations have to be analysed. Experimental evidences have been collected as first step on advanced CMOS technologies, and their extension to the smart-power families, where digital and power coexist together, will be shortly discussed in this paper. Highlights: Quality and reliability targets in Automotive give the opportunity to consider components eligible to Aerospace. Reliability gaps have been identified and studied between Automotive and Aerospace environments. An extension of the "robust qualification" Automotive policy, through a failure mechanism driven approach, is proposed. An innovative approach has been key to cover the most crucial aspects related to cold operating temperature. The outcome of the present study is that Automotive components have significant potential in an Aerospace application.