Experimental investigation of a Peltier cells cooling system for a Switch-Mode Power Supply. (December 2017)

• Record Type: Journal Article
• Authors: Casano, G.; Piva, S.
• Is Part Of: Microelectronics and reliability. Volume 79(2017)
• Page Start: 426
• Page End: 432
• Publication Date: 2017-12
• Subjects: DL dummy load -- EER energy efficiency ratio (Eq. (2)) -- SMPS Switch Mode Power Supply -- TEC thermoelectric cooler; Electronic apparatus and appliances -- Reliability -- Periodicals; Miniature electronic equipment -- Periodicals; Appareils électroniques -- Fiabilité -- Périodiques; Équipement électronique miniaturisé -- Périodiques; Electronic apparatus and appliances -- Reliability; Miniature electronic equipment; Periodicals; 621.3815
• DOI: 10.1016/j.microrel.2017.05.042
• Languages: English
• ISSNs: 0026-2714

Abstract

Abstract: The results are presented of an experimental investigation in a liquid cooled Switch-Mode Power Supply (SMPS). The target is a quantitative analysis of the performance of a cooling system designed to dissipate the heat generated by the active and passive electronic components of this SMPS, in order to limit its maximum operational temperature. The active components are cooled with a liquid cold plate. The passive components are cooled with an air flow. The temperature of this airflow is controlled with Peltier cells exchanging heat with the cold plate. Measurements are made of temperature and of electric efficiency of the SMPS. The cooling system is placed in an experimental tool where it is possible to measure and control the cooling liquid flow. A detailed analysis of the thermal behaviour of this cooling system is given. Finally, the practical significance of the problem is discussed. Highlights: Experimental investigation of a new cooling system for electronic equipments. The cooling system combines liquid and air cooling. A cold plate is used to cool the active components. An airflow is used to cool the passive components. Peltier cells are used to integrate liquid and air cooling.