Cite
MLA Citation
K. Fellner et al.. “Method development for the cyclic characterization of thin copper layers for PCB applications.” Circuit world, vol. 40, no. 2, 2014, pp. 53–60. http://access.bl.uk/ark:/81055/vdc_100052797721.0x00004c
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K. Fellner et al.. “Method development for the cyclic characterization of thin copper layers for PCB applications.” Circuit world, vol. 40, no. 2, 2014, pp. 53–60. http://access.bl.uk/ark:/81055/vdc_100052797721.0x00004c