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APA Citation

    Fang, M., Lu, C. H., Lai, H. X., Huang, L. Q., Chen, J., Ma, W. H., Sheng, Z. L., Shen, J. N., Li, J. T., & Luo, X. T. (n.d.). effect of solidification rate on representative impurities distribution in Si–Cu alloy. Materials science and technology, 29, 861–867. http://access.bl.uk/ark:/81055/vdc_100052500908.0x000041
  
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