Synthesis of SnAgCu nanoparticles with low melting point by the chemical reduction method. (November 2017)

• Record Type: Journal Article
• Authors: Wang, Yang; Liu, Wenxiao; Liu, Wei; He, Peng; Fan, Zhonghua; Wang, Xiaorong; Yu, Dingkun; Guo, Jiayu; Guo, Bing; Shen, Hangyan
• Is Part Of: Microelectronics and reliability. Volume 78(2017)
• Page Start: 17
• Page End: 24
• Publication Date: 2017-11
• Subjects: SnAgCu nanoparticles -- Chemical reduction method -- Process parameters -- Low melting point -- Solderability property; Electronic apparatus and appliances -- Reliability -- Periodicals; Miniature electronic equipment -- Periodicals; Appareils électroniques -- Fiabilité -- Périodiques; Équipement électronique miniaturisé -- Périodiques; Electronic apparatus and appliances -- Reliability; Miniature electronic equipment; Periodicals; 621.3815
• DOI: 10.1016/j.microrel.2017.07.069
• Languages: English
• ISSNs: 0026-2714

Abstract

Abstract: SnAgCu alloy with low melting point and good soldering property is a good candidate for the Sn/Pb eutectic. In this paper, SnAgCu nanoparticles were synthesized by a chemical reduction method. The particle size and the melting point are controlled by modifying the process parameters, including reaction temperature, surfactant concentration and dropping speed of precursor. The lowest melting onset temperature is observed at 199.1 °C, which is 18 °C lower than that of commercially available SnAgCu solder alloy. The tensile strength of the as-synthesized reaches 34.3 MPa, which reveals a good solderability property. Highlights: SnAgCu nanoparticles with low melting point were synthesized via the chemical reduction method. The size control and the melting temperature of nanoparticles was analyzed by changing the process parameters. The lowest melting point is observed at 199.1 °C. The tensile strength of the as-synthesized SAC solder reaches 34.3 MPa.