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HARVARD Citation
d'Alessandro, V. et al. (2017). Simulation comparison of InGaP/GaAs HBT thermal performance in wire-bonding and flip-chip technologies. Microelectronics and reliability. pp. 233-242. [Online].
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d'Alessandro, V. et al. (2017). Simulation comparison of InGaP/GaAs HBT thermal performance in wire-bonding and flip-chip technologies. Microelectronics and reliability. pp. 233-242. [Online].