Cite
MLA Citation
Ann N. Chiaramonti et al.. “Failure Analysis and Reliability of Low-Temperature-Grown Multi-Wall Carbon Nanotube Bundles Integrated as Vias in Monolithic Three-Dimensional Integrated Circuits.” Microscopy and microanalysis, vol. 20, n.d., pp. 1762–1763. http://access.bl.uk/ark:/81055/vdc_100050732723.0x000014