Cite
MLA Citation
Liang Zhang et al.. “Cu/SnAgCu/Cu TLP with different thicknesses for 3D IC.” Soldering & surface mount technology, vol. 29, no. 3, 2017, pp. 151–155. http://access.bl.uk/ark:/81055/vdc_100047118100.0x000037
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Liang Zhang et al.. “Cu/SnAgCu/Cu TLP with different thicknesses for 3D IC.” Soldering & surface mount technology, vol. 29, no. 3, 2017, pp. 151–155. http://access.bl.uk/ark:/81055/vdc_100047118100.0x000037