Laser Ultrasonic Thin Film Characterization of Si-Cu-Al-Cu Multi-Layered Stacks. (2017)

• Record Type: Journal Article
• Authors: Grünwald, Eva; Nuster, Robert; Paltauf, Günther; Maier, Thomas; Wimmer-Teubenbacher, Robert; Konetschnik, Ruth; Kiener, Daniel; Leitgeb, Verena; Köck, Anton; Brunner, Roland
• Is Part Of: Materials today. Volume 4:Number 7(2017)Part 2
• Page Start: 7122
• Page End: 7127
• Publication Date: 2017
• Subjects: Thin Film Characterization -- Laser Ultrasound -- Multi-Layered Systems -- Stack Charakterization; Materials science -- Congresses -- Periodicals; 620.1
• DOI: 10.1016/j.matpr.2017.08.006
• Languages: English
• ISSNs: 2214-7853

Abstract

Abstract: In this work, the step-wise determination of elastic properties of a Si-Cu-Al-Cu stack via laser induced ultrasonic measurements is presented. The analysed Si-Cu-Al-Cu system consists of a silicon (100) substrate, two copper layers and an aluminium layer embedded between the copper layers, with a thickness of about 1 µm of each layer. The obtained results for the Young's moduli and Poisson's ratios of the multi-layered system are compared to literature values for bulk materials. The presented non-contact method shows high potential regarding the non-destructive evaluation of elastic properties of thin films in multi-layered systems.