A review of lead-free solders for electronics applications. (August 2017)

• Record Type: Journal Article
• Authors: Cheng, Shunfeng; Huang, Chien-Ming; Pecht, Michael
• Is Part Of: Microelectronics and reliability. Volume 75(2017)
• Page Start: 77
• Page End: 95
• Publication Date: 2017-08
• Subjects: Lead-free solders -- Electronics -- Reliability -- SAC -- Alternative solders; Electronic apparatus and appliances -- Reliability -- Periodicals; Miniature electronic equipment -- Periodicals; Appareils électroniques -- Fiabilité -- Périodiques; Équipement électronique miniaturisé -- Périodiques; Electronic apparatus and appliances -- Reliability; Miniature electronic equipment; Periodicals; 621.3815
• DOI: 10.1016/j.microrel.2017.06.016
• Languages: English
• ISSNs: 0026-2714

Abstract

Abstract: Ever since RoHS was implemented in 2006, Sn3.0Ag0.5Cu (SAC305) has been the primary lead-free solder for attaching electronic devices to printed circuit boards (PCBs). However, due to the 3.0 wt% Silver (Ag) in SAC305, companies have been looking at less expensive solder alternatives, especially for use in inexpensive products that have short operating lives and are used in mild application conditions. This paper reviews new lead-free solder alternatives and the trends in the industry, including SnCu-based solders, SnAgCu solders with Ag content < 1.0 wt%, SnAg solders, and no-Ag low-temperature solders (e.g., SnBi-based solders). The analysis is conducted for reflow, wave, and rework conditions and for packaged and flip-chip devices.