Fuzzy logic approach for investigation of microstructure and mechanical properties of Sn96.5-Ag3.0-Cu0.5 lead free solder alloy. Issue 4 (4th September 2017)
- Record Type:
- Journal Article
- Title:
- Fuzzy logic approach for investigation of microstructure and mechanical properties of Sn96.5-Ag3.0-Cu0.5 lead free solder alloy. Issue 4 (4th September 2017)
- Main Title:
- Fuzzy logic approach for investigation of microstructure and mechanical properties of Sn96.5-Ag3.0-Cu0.5 lead free solder alloy
- Authors:
- Aamir, Muhammad
, Izhar
Waqas, Muhammad
Iqbal, Muhammad
Hanif, Muhammad Imran
Muhammad, Riaz - Abstract:
- Abstract : Purpose: This paper aims to develop a fuzzy logic-based algorithm to predict the intermetallic compound (IMC) size and mechanical properties of soldering material, Sn96.5-Ag3.0-Cu0.5 (SAC305) alloy, at different levels of temperature. The reliability of solder joint in materials selection is critical in terms of temperature, mechanical properties and environmental aspects. Owing to a wide range of soldering materials available, the selection space finds a fuzzy characteristic. Design/methodology/approach: The developed algorithm takes thermal aging temperature for SAC305 alloy as input and converts it into fuzzy domain. These fuzzified values are then subjected to a fuzzy rule base, where a set of rules determines the IMC size and mechanical properties, such as yield strength (YS) and ultimate tensile strength (UTS) of SAC305 alloy. The algorithm is successfully simulated for various input thermal aging temperatures. To analyze and validate the developed algorithm, an SAC305 lead (Pb)-free solder alloy is developed and thermally aged at 40, 60 and 100°C temperature. Findings: The experimental results indicate an average IMCs size of 5.967 (in Pixels), 19.850 N/mm 2 YS and 22.740 N/mm 2 UTS for SAC305 alloy when thermally aged at an elevated temperature of 140°C. In comparison, the simulation results predicted 5.895 (in Pixels) average IMCs size, 19.875 N/mm 2 YS and 22.480 N/mm 2 UTS for SAC305 alloy at 140°C thermally aged temperature. Originality/value: From theAbstract : Purpose: This paper aims to develop a fuzzy logic-based algorithm to predict the intermetallic compound (IMC) size and mechanical properties of soldering material, Sn96.5-Ag3.0-Cu0.5 (SAC305) alloy, at different levels of temperature. The reliability of solder joint in materials selection is critical in terms of temperature, mechanical properties and environmental aspects. Owing to a wide range of soldering materials available, the selection space finds a fuzzy characteristic. Design/methodology/approach: The developed algorithm takes thermal aging temperature for SAC305 alloy as input and converts it into fuzzy domain. These fuzzified values are then subjected to a fuzzy rule base, where a set of rules determines the IMC size and mechanical properties, such as yield strength (YS) and ultimate tensile strength (UTS) of SAC305 alloy. The algorithm is successfully simulated for various input thermal aging temperatures. To analyze and validate the developed algorithm, an SAC305 lead (Pb)-free solder alloy is developed and thermally aged at 40, 60 and 100°C temperature. Findings: The experimental results indicate an average IMCs size of 5.967 (in Pixels), 19.850 N/mm 2 YS and 22.740 N/mm 2 UTS for SAC305 alloy when thermally aged at an elevated temperature of 140°C. In comparison, the simulation results predicted 5.895 (in Pixels) average IMCs size, 19.875 N/mm 2 YS and 22.480 N/mm 2 UTS for SAC305 alloy at 140°C thermally aged temperature. Originality/value: From the experimental and simulated results, it is evident that the fuzzy-based developed algorithm can be used effectively to predict the IMCs size and mechanical properties of SAC305 at various aging temperatures, for the first time. … (more)
- Is Part Of:
- Soldering & surface mount technology. Volume 29:Issue 4(2017)
- Journal:
- Soldering & surface mount technology
- Issue:
- Volume 29:Issue 4(2017)
- Issue Display:
- Volume 29, Issue 4 (2017)
- Year:
- 2017
- Volume:
- 29
- Issue:
- 4
- Issue Sort Value:
- 2017-0029-0004-0000
- Page Start:
- 191
- Page End:
- 198
- Publication Date:
- 2017-09-04
- Subjects:
- Fuzzy logic -- Mechanical properties -- Intermetallic compound -- Lead free solder -- Thermal aging
Brazing -- Periodicals
Solder and soldering -- Periodicals
671.5605 - Journal URLs:
- http://www.emeraldinsight.com/journals.htm?issn=0954-0911 ↗
http://www.emeraldinsight.com/ ↗ - DOI:
- 10.1108/SSMT-02-2017-0005 ↗
- Languages:
- English
- ISSNs:
- 0954-0911
- Deposit Type:
- Legaldeposit
- View Content:
- Available online (eLD content is only available in our Reading Rooms) ↗
- Physical Locations:
- British Library DSC - 8327.242650
British Library DSC - BLDSS-3PM
British Library HMNTS - ELD Digital store - Ingest File:
- 4606.xml