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APA Citation
Marasso, S. L., Benetto, S., Para, I., Ottone, C., Mombello, D., Perrone, D., Ferrero, S., Scaltrito, L., Pugliese, D., Cocuzza, M., & Pirri, F. C. (2017). back plate electroplating for high aspect ratio processes. Microelectronics international, 34(2), 69–74. http://access.bl.uk/ark:/81055/vdc_100046163535.0x000025