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APA Citation
Yoon, H., Choi, K., Bae, H., Moon, J., Eom, Y., & Jeon, I. (2017). evaluating the material properties of underfill for a reliable 3D TSV integration package using numerical analysis. Microelectronics and reliability, 71, 41–50. http://access.bl.uk/ark:/81055/vdc_100045296757.0x000056