Evaluation of Schottky barrier source/drain contact on gate-all-around polycrystalline silicon nanowire MOSFET. (April 2017)
- Record Type:
- Journal Article
- Title:
- Evaluation of Schottky barrier source/drain contact on gate-all-around polycrystalline silicon nanowire MOSFET. (April 2017)
- Main Title:
- Evaluation of Schottky barrier source/drain contact on gate-all-around polycrystalline silicon nanowire MOSFET
- Authors:
- Ho, Ching-Yuan
Chang, Yew-Jen - Abstract:
- Abstract: Self-aligned nickel salicide of gate-all-around silicon nanowires (GAA Si NWs) MOSFET has been investigated using very-large-scale integration (VLSI) process. The nickel salicide (NiSix ) characteristics including sheet resistance (Rs ), phase transformation and Schottky barrier height (SBH) are discussed via line structures and Schottky diode, respectively. RTA temperature strongly affects Rs of NiSix and related with surface morphology. Below 700 °C, near 4.5 Ω/□ of smooth surface of NiSi Rs is obtained in comparison with 12.6 Ω/□ of NiSi2 at 700 °C. Both forward bias of current-voltage (I-V) and temperature-dependency of activation-energy methods have been used to characterize Schottky barrier height (SBH). For 400 °C RTA sample, the SBH and ideality factor extracted from the forward bias of current-voltage (I-V) method are 0.38 eV and 1.53, respectively. Besides, the SBH extracted from temperature-dependency of activation-energy methods is 2.9 eV. The variation of SBH values are attributed to the thermionic-field emission (TFE) which the interface states and inhomogeneity induce slightly tunneling current. Moreover, various channel lengths of Schottky source/drain contacts of GAA Si NWs MOSFET devices were measured and results demonstrate that enough electrical performances combined with ambipolar behavior are available for future application in logical circuit and non-volatile memory.
- Is Part Of:
- Materials science in semiconductor processing. Volume 61(2017)
- Journal:
- Materials science in semiconductor processing
- Issue:
- Volume 61(2017)
- Issue Display:
- Volume 61, Issue 2017 (2017)
- Year:
- 2017
- Volume:
- 61
- Issue:
- 2017
- Issue Sort Value:
- 2017-0061-2017-0000
- Page Start:
- 150
- Page End:
- 155
- Publication Date:
- 2017-04
- Subjects:
- Rapid thermal annealing (RTA) -- Nickel silicide (NiSix) -- Schottky barrier height (SBH) -- Activation-energy -- Thermionic-field emission (TFE)
Semiconductors -- Periodicals
Integrated circuits -- Materials -- Periodicals
Semiconducteurs -- Périodiques
Circuits intégrés -- Matériaux -- Périodiques
Electronic journals
621.38152 - Journal URLs:
- http://www.sciencedirect.com/science/journal/latest/13698001 ↗
http://www.elsevier.com/journals ↗ - DOI:
- 10.1016/j.mssp.2016.11.029 ↗
- Languages:
- English
- ISSNs:
- 1369-8001
- Deposit Type:
- Legaldeposit
- View Content:
- Available online (eLD content is only available in our Reading Rooms) ↗
- Physical Locations:
- British Library DSC - 5396.440600
British Library DSC - BLDSS-3PM
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- 2215.xml