In0.18Al0.82N/AlN/GaN MIS-HEMT on Si with Schottky-drain contact. (March 2017)

• Record Type: Journal Article
• Authors: Chen, P.-G.; Tang, M.; Liao, M.-H.; Lee, M.H.
• Is Part Of: Solid-state electronics. Volume 129(2017)
• Page Start: 206
• Page End: 209
• Publication Date: 2017-03
• Subjects: InAlN -- Ohmic -- Schottky -- High-electron-mobilitytransistor (HEMT); Semiconductors -- Periodicals; Semiconducteurs -- Périodiques; 621.38152
• DOI: 10.1016/j.sse.2016.11.002
• Languages: English
• ISSNs: 0038-1101

Abstract

Highlights: InAlN/AlN/GaN HEMT directly on Si with hybrid Ohmic and Schottky source/drain. In0.18 Al0.82 N has the advantages of high polarization, power density and reliability as compared with the conventional AlGaN barrier due to the lattice matches to GaN. High ON/OFF (∼10 8 ) ratio In0.18 Al0.82 N/AlN/GaN HEMT on Si are demonstrated. OFF current reduces 1 magnitude by Hybrid S/D as compared with the control InAlN/AlN/GaN-on-Si MOS-HEMTs with Ohmic contact. The InAlN HEMTs growth on Si substrate has the advantages of high throughput, CMOS compatible wafer-scale, and low cost than the conventional epitaxy substrate, such as SiC or sapphire. Abstract: Indium-based ternary-barrier high-electron-mobility transistors (HEMT) directly on Si substrate are demonstrated in this work, using a structure of In0.18 Al0.82 N/AlN/GaN-on-Si for high-power applications. The advantages of HEMTs on Si substrates are the low cost and high throughput, which are beneficial for large wafer scale. The thermal dissipation of Si occurs between SiC and the sapphire substrate. The proposed InAlN-barrier HEMTs exhibit a high ON/OFF ratio with >7 orders of magnitudes and an excellent subthreshold swing (SS) below 100 mV/dec, owing to high polarization and less lattice mismatch with GaN. The IDsat is measured to be 163 mA/mm at VDS = 10 V and VG = 2 V with LG = 2 μm. When compared with the control InAlN/AlN/GaN-on-Si MIS-HEMTs with Ohmic contacts, the OFF current is reduced by one order magnitude when using the Schottky-drain contact technology.