A perspective of the IPC report on lead-free electronics in military/aerospace applications. (February 2017)

• Record Type: Journal Article
• Authors: Fortier, Aleksandra; Pecht, Michael G.
• Is Part Of: Microelectronics and reliability. Volume 69(2017)
• Page Start: 66
• Page End: 70
• Publication Date: 2017-02
• Subjects: Lead-free electronics -- Lead-free solders -- Sn whiskers -- Military/aerospace application -- RoHS exempt -- Reliability risks; Electronic apparatus and appliances -- Reliability -- Periodicals; Miniature electronic equipment -- Periodicals; Appareils électroniques -- Fiabilité -- Périodiques; Équipement électronique miniaturisé -- Périodiques; Electronic apparatus and appliances -- Reliability; Miniature electronic equipment; Periodicals; 621.3815
• DOI: 10.1016/j.microrel.2017.01.001
• Languages: English
• ISSNs: 0026-2714

Abstract

Abstract: Significant progress towards lead-free technology implementation has been made in the last decade. However, majority of the successful transition has been done within consumer electronics industry while high reliability military/aerospace products are yet to fully transition. This study discusses viewpoint on the recent IPC report published on lead-free electronics in military and aerospace applications. Additionally, reliability considerations are discussed, and guidelines along with standards for robust transition and implementation towards lead-free technology is presented. A "preventive" transition approach based upon more accurate models of failure mechanisms and life prediction than are currently available will be required in order to assess successful implementation within military/aerospace products and for high reliability to be achieved.