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W. Fu et al.. “Effect of Ti content on the wetting behavior of Sn0.3Ag0.7Cu/AlN system.” Materials & design, vol. 115, 2017, pp. 1–7. http://access.bl.uk/ark:/81055/vdc_100040777946.0x000018
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W. Fu et al.. “Effect of Ti content on the wetting behavior of Sn0.3Ag0.7Cu/AlN system.” Materials & design, vol. 115, 2017, pp. 1–7. http://access.bl.uk/ark:/81055/vdc_100040777946.0x000018