Studying heat transfer on inclined printed circuit boards during vapour phase soldering. Issue 1 (6th February 2017)

• Record Type: Journal Article
• Authors: Geczy, Attila; Nagy, Daniel; Illes, Balazs; Fazekas, Laszlo; Krammer, Oliver; Busek, David
• Is Part Of: Soldering & surface mount technology. Volume 29:Issue 1(2017)
• Page Start: 34
• Page End: 41
• Publication Date: 2017-02-06
• Subjects: Reflow soldering -- Thermal profiling -- Filmwise condensation -- Inclination -- Vapour phase soldering; Brazing -- Periodicals; Solder and soldering -- Periodicals; 671.5605
• DOI: 10.1108/SSMT-11-2016-0029
• Languages: English
• ISSNs: 0954-0911

Abstract

Abstract : Purpose: The paper aims to present an investigation of heating during vapour phase soldering (VPS) on inclined printed circuit board (PCB) substrates. The PCB is a horizontal rectangular plate from the aspect of filmwise condensation with a given inclination setting. Design/methodology/approach: The paper focuses on the measurement of temperature distribution on the PCBs with a novel setup immersed in the saturated vapour space. The measuring instrumentation is optimized to avoid and minimize vapour perturbing effects. Findings: The inhomogeneity of the heating is presented according to the lateral dimensions of the PCB. The inclination improves temperature uniformity, improves heat transfer efficiency; however, a minor misalignment may affect the flow and result in uneven heating. Practical implications: The results can be implemented for practical improvements in industrial ovens with the use of intended inclination. The improvements may consequently point to more efficient production and better joint quality. Originality/value: The novel method can be used for deeper investigation of inclination during and can be complemented with numerical calculations. The results highlight the importance of precise PCB holding instrumentation in VPS ovens.