Cite
MLA Citation
Xingchen Yan et al.. “Effect of P and Ge doping on microstructure of Sn-0.3Ag-0.7Cu/Ni-P solder joints.” Soldering & surface mount technology, vol. 28, no. 4, 2016, pp. 215–221. http://access.bl.uk/ark:/81055/vdc_100039856485.0x000040