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APA Citation

    Xian, J., Ma, Z., Belyakov, S., Ollivier, M., & Gourlay, C. (2017). nucleation of tin on the Cu6Sn5 layer in electronic interconnections. Acta materialia, 123, 404–415. http://access.bl.uk/ark:/81055/vdc_100039063263.0x000042
  
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