Constitutive modeling of solder alloys for drop-impact applications. (December 2016)
- Record Type:
- Journal Article
- Title:
- Constitutive modeling of solder alloys for drop-impact applications. (December 2016)
- Main Title:
- Constitutive modeling of solder alloys for drop-impact applications
- Authors:
- Wong, E.H.
Chrisp, J.
Selvanayagam, C.S.
Seah, S.K.W. - Abstract:
- Abstract: The stress-strain data of four solder alloys - Sn37Pb, Sn1·0Ag0.1Cu, Sn3·5Ag, and Sn3·0Ag0.5Cu – at seven initial strain rates between 0.005 s − 1 to 300 s − 1 have been generated using a combination of mechanical and drop-weight compression tests. Assuming negligible inertia of the test specimen, the stress-strain-strain rate characteristics σ ( ε, ε ̇ ( ε )) of a solder alloy can be readily evaluated from the measured time history of the impact force in a drop-weight compression test. The stress-strain-strain rate characteristics are transformed to the condition of isostrain rate σ ( ε, ε ̇ iso ) while being curve-fitted to the Johnson-Cook and the Pernzya models. The former represents the dynamic-yield model and the latter the viscoplastic model. The quality of the extracted material constants for the Johnson-Cook model are validated by (i) reproducing the impact force-time characteristic of the Sn37Pb solder test specimen using finite element analysis and using the extracted material constants; and (ii) extracting the material constants for the Sn37Pb solder alloy using the inherent optimisation capability of commercial finite element code. Highlights: Technique for characterizing the dynamic stress-strain properties of metals Transformed σ ( ε, ε ̇ ( ε )) to isostrain rate condition σ ( ε, ε ̇ iso ) Extracted material constants for Johnson-Cook and Pernzy models for solder alloys Validated against material constants for Johnson-Cook model using FEA optimisation
- Is Part Of:
- Microelectronics and reliability. Volume 67(2016)
- Journal:
- Microelectronics and reliability
- Issue:
- Volume 67(2016)
- Issue Display:
- Volume 67, Issue 2016 (2016)
- Year:
- 2016
- Volume:
- 67
- Issue:
- 2016
- Issue Sort Value:
- 2016-0067-2016-0000
- Page Start:
- 135
- Page End:
- 142
- Publication Date:
- 2016-12
- Subjects:
- Drop-impact -- Dynamic yield -- Viscoplastic -- Johnson-Cook -- Perzyna
Electronic apparatus and appliances -- Reliability -- Periodicals
Miniature electronic equipment -- Periodicals
Appareils électroniques -- Fiabilité -- Périodiques
Équipement électronique miniaturisé -- Périodiques
Electronic apparatus and appliances -- Reliability
Miniature electronic equipment
Periodicals
621.3815 - Journal URLs:
- http://www.sciencedirect.com/science/journal/00262714 ↗
http://www.elsevier.com/journals ↗
http://www.elsevier.com/homepage/elecserv.htt ↗ - DOI:
- 10.1016/j.microrel.2016.10.007 ↗
- Languages:
- English
- ISSNs:
- 0026-2714
- Deposit Type:
- Legaldeposit
- View Content:
- Available online (eLD content is only available in our Reading Rooms) ↗
- Physical Locations:
- British Library DSC - 5758.979000
British Library DSC - BLDSS-3PM
British Library HMNTS - ELD Digital store - Ingest File:
- 1808.xml