Cite
HARVARD Citation
Kim, Y. et al. (2016). Prediction of deformation during manufacturing processes of silicon interposer package with TSVs. Microelectronics and reliability. pp. 234-242. [Online].
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Kim, Y. et al. (2016). Prediction of deformation during manufacturing processes of silicon interposer package with TSVs. Microelectronics and reliability. pp. 234-242. [Online].