Cite
HARVARD Citation
Ding, M. et al. (2016). A Study of Ta-Si-N/Ti Bilayer Diffusion Barrier for Copper/Silicon Contact Systems. Materials and manufacturing processes. 31 (8), pp. 1009-1013. [Online].
This is an interim version of our Electronic Legal Deposit Catalogue-eJournals and eBooks while we continue to recover from a cyber-attack.
Ding, M. et al. (2016). A Study of Ta-Si-N/Ti Bilayer Diffusion Barrier for Copper/Silicon Contact Systems. Materials and manufacturing processes. 31 (8), pp. 1009-1013. [Online].