Cite
MLA Citation
Yingxia Liu et al.. “Fracture reliability concern of (Au, Ni)Sn4 phase in 3D integrated circuit microbumps using Ni/Au surface finishing.” Scripta materialia, vol. 119, 2016, pp. 9–12. http://access.bl.uk/ark:/81055/vdc_100032061772.0x000020