Observer based dynamic adaptive cooling system for power modules. (March 2016)

• Record Type: Journal Article
• Authors: Wang, Xiang; Castellazzi, Alberto; Zanchetta, Pericle
• Is Part Of: Microelectronics and reliability. Volume 58(2016)
• Page Start: 113
• Page End: 118
• Publication Date: 2016-03
• Subjects: Cooling -- Reliability -- Temperature control -- Thermal stress -- Thermal cycle -- Lifetime; Electronic apparatus and appliances -- Reliability -- Periodicals; Miniature electronic equipment -- Periodicals; Appareils électroniques -- Fiabilité -- Périodiques; Équipement électronique miniaturisé -- Périodiques; Electronic apparatus and appliances -- Reliability; Miniature electronic equipment; Periodicals; 621.3815
• DOI: 10.1016/j.microrel.2016.01.020
• Languages: English
• ISSNs: 0026-2714

Abstract

Abstract: This paper presents an advanced dynamic cooling strategy for multi-layer structured power electronic modules. An observer based feedback controller is proposed to reduce a power device or module's thermal cycle amplitude during operation, with the aim of improving reliability and lifetime. The full-state observer design is based on a developed Cauer type thermal model. The observer enables estimation and control of the temperature at reliability critical locations only measuring one accessible location. This makes the method particularly powerful and suitable for application in power systems. The designed strategy is confirmed experimentally. Although the experiment is developed for a specific application scenario, the proposed strategy is of general validity. Highlights: Advanced cooling methodology proposal State-space thermal modelling and use of observer for advanced/non-invasive implementation Observer validation under fast transient response Demonstrated reduction of operational ΔT Demonstrated reduced degradation of power modules subjected to realistic mission profiles