Cite
APA Citation
Cowley, A., Ivankovic, A., Wong, C., Bennett, N., Danilewsky, A., Gonzalez, M., Cherman, V., Vandevelde, B., De Wolf, I., & McNally, P. (2016). b-Spline X-Ray Diffraction Imaging — Rapid non-destructive measurement of die warpage in ball grid array packages. Microelectronics and reliability, 59, 108–116. http://access.bl.uk/ark:/81055/vdc_100031458418.0x000055