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MLA Citation
Yazhou Zhang et al.. “Microstructure of Electrodeposited Cu Micro-cylinders in High-Aspect-Ratio Blind Holes and Crystallographic Texture of the Cu Overburden Film.” Journal of materials science & technology, vol. 32, no. 4, n.d., pp. 355–361. http://access.bl.uk/ark:/81055/vdc_100031458267.0x000002