Dynamic compact thermal model of high power light emitting diode. Issue 12 (December 2015)

• Record Type: Journal Article
• Authors: Lai, Wei; Liu, Xianming; Chen, Weimin; Lei, Xiaohua; Cao, Xueying
• Is Part Of: Microelectronics and reliability. Volume 55:Issue 12 Part B(2015)
• Page Start: 2663
• Page End: 2670
• Publication Date: 2015-12
• Subjects: Dynamic compact thermal model -- Time constant spectra -- Thermal resistance -- Light emitting diode; Electronic apparatus and appliances -- Reliability -- Periodicals; Miniature electronic equipment -- Periodicals; Appareils électroniques -- Fiabilité -- Périodiques; Équipement électronique miniaturisé -- Périodiques; Electronic apparatus and appliances -- Reliability; Miniature electronic equipment; Periodicals; 621.3815
• DOI: 10.1016/j.microrel.2015.10.001
• Languages: English
• ISSNs: 0026-2714

Abstract

Abstract: Dynamic compact thermal model plays important roles in predicting the junction temperature and characterizing the transient thermal behavior of an electronic device. In this paper, analytical dynamic compact thermal model for high power LEDs is established based on the three-directional heat flow paths under junction-to-ambient definition. Comparative results with finite element method model indicate that the presented model is accurate and efficient. It is further reduced by analyzing the influence of different components of the LED package. Good agreement with experimental results confirms that the reduced analytical model can predict the junction temperature and characterize the thermal behavior effectively. Highlights: Analytical dynamic compact thermal model is proposed for high power LED. Time constant spectra are verification criterion with detailed numerical model. Experimental results agree well with analytical and numerical model. Model is further reduced through influence analysis on time constant spectra. Reduced model can accurately predict the thermal transient behavior.