Cite
HARVARD Citation
Nagy, G. et al. (2015). Advancing the thermal stability of 3D ICs using logi-thermal simulation. Microelectronics journal. 46 (12), pp. 1114-1120. [Online].
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Nagy, G. et al. (2015). Advancing the thermal stability of 3D ICs using logi-thermal simulation. Microelectronics journal. 46 (12), pp. 1114-1120. [Online].