Advancing the thermal stability of 3D ICs using logi-thermal simulation. Issue 12 (December 2015)

• Record Type: Journal Article
• Authors: Nagy, Gergely; Horváth, Péter; Pohl, László; Poppe, András
• Is Part Of: Microelectronics journal. Volume 46:Issue 12 Part A (2015)
• Page Start: 1114
• Page End: 1120
• Publication Date: 2015-12
• Subjects: Logi-thermal simulation -- 3D IC -- Stacked-die; Microelectronics -- Periodicals; Microélectronique -- Périodiques; Microelectronics; Electronic journals; Journals - contents and abstracts; Periodicals; 621.3805
• DOI: 10.1016/j.mejo.2015.06.025
• Languages: English
• ISSNs: 0959-8324

Abstract

Abstract: 3D ICs have emerged in the past few years. While they solve a large number of problems related to scaling, they also create new ones. Removing the heat from the layers far from the cooling facilities is a great challenge still under intensive research. This paper shows how logi-thermal simulation can be used to predict the operation parameters of large digital systems realized in 3D ICs. The method can be effectively used to guide place-and-route algorithms and to find the thermal bottlenecks.